Journal Papers in Press or Submitted

Righi, M., Tardioli, G., Cascio, L., Hoefer, W.J.R., "Time Domain Characterization of Packaging Effects via Segmentation Technique", accepted for publication in Special Issue on Packaging and Interconnects, IEEE Trans. Microwave Theory and Techniques. Vol. MTT-45.

Eswarappa, C. and Hoefer, W.J.R., "Radar Cross-Section of Metallic and Dielectric Cubes Computed with SCN-TLM and FD-TD Methods", IEEE Trans. Antennas and Propagation, (Submitted)

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